KLA | Investor Day Presentation Deck | 142 slides

Slide schematic 9/9

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Components 9

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Tools 1

Wafer singulation is usually done with blade and/or laser, which creates particles and cracks. Defects can lead to failures of entire multi-die package, causing huge economic losses.

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No metric insight is anchored to this slide.

Frameworks 1

before-after-framing 100%

The slide explicitly contrasts the 'Problem' (blade/laser dicing) with the 'Solution' (plasma dicing) and shows the 'Results' (cleaner edges).

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The slide uses a before-after framing to contrast traditional blade dicing with the company's plasma dicing solution.