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      "text": "Developed differentiated plasma dicing solution. State-of-the-art demo lab created to develop full integration process around wafer singulation. Validated process performance via multiple advanced customer collaborations.",
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      "text": "Wafer singulation is usually done with blade and/or laser, which creates particles and cracks. Defects can lead to failures of entire multi-die package, causing huge economic losses. Plasma etch based singulation provides superior cleanliness, but integration is complex.",
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