KLA | Investor Conference Presentation Deck | 30 slides · page 20 of 30
The slide uses a process flow diagram on the left and a pie chart with callout boxes on the right to quantify the effectiveness of I-PAT in catching latent defects.
Conference presentation · propose_solution · present_solution · dense density
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pie process illustration bullet headline
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Data Story Arc slide · 60%
5.3% of I-PAT die pass electrical wafer sort, but fail final test; 1.5% of I-PAT die pass final test, but fail burn-in; Remaining 22% of I-PAT die pass all electrical test
Problem-Agitate-Solve (PAS) slide · 70%I-PAT enables the detection of latent reliability defects that standard testing processes miss.
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