KLA | Investor Conference Presentation Deck | 28 slides

KLA · 2021-06
arc beats above · slides in the middle · loops below · scroll → 2 LOOPS
SETUP TENSION ANALYSIS EVIDENCE RESOLUTION APPENDIX
HOVER FOR DETAILS · CLICK A SLIDE FOR FULLSCREEN · STEP 1
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Deck intelligence map

4
coverage by narrative range · generated from this deck JSON

Slide inventory

28
every slide · same image gating as the playbook
01
Slide 1
front_matter
Open slide detailBeat · Attention
02
other
Open slide detailBeat · Attention
03
front_matter
Open slide detailBeat · Attention
04
summarize
Open slide detailBeat · Attention
05
The slide uses a color-coded timeline of market segments (AI, 5G, etc.) above a chart showing revenue growth projections.analyze_data
Open slide detailBeat · Attention
06
Uses two aphorisms: 'you can't fix what you can't find' and 'you can't control what you can't measure'.frame_problem
Open slide detailBeat · Need
07
front_matter
Open slide detailBeat · Need
08
Slide 8 of a corporate presentation.summarize
Open slide detailBeat · Need
09
The slide uses a horizontal axis to represent decreasing feature geometry (20µm to 0.1µm) to categorize different manufacturing segments.present_framework
Open slide detailBeat · Need
10
The slide features a circular diagram representing the KLA Operating Model.introduce_nominees
Open slide detailBeat · Need
11
The slide contrasts traditional logic scaling (Moore's Law) with broader industry segments (EPC).frame_situation
Open slide detailBeat · Need
12
The slide uses a process flow diagram to map KLA's business units (GSS, SPC, EPC) to specific stages of the semiconductor manufacturing process and their corresestablish_context
Open slide detailBeat · Need
13
The slide uses a stylized map representation where icons are clustered by region.analyze_data
Open slide detailBeat · Need
14
front_matter
Open slide detailBeat · Need
15
The slide uses a visual representation of shrinking squares to demonstrate Moore's Law/transistor scaling.establish_context
Open slide detailBeat · Satisfaction
16
The slide contrasts legacy packaging (left) with modern 3D integration (center and right) to show the shift in industry focus.present_framework
Open slide detailBeat · Satisfaction
17
The slide displays cross-sectional diagrams of different packaging types like Time of Flight, InFO-oS, 2.5D-3D, AiP, CIS, SiP, and QFN.illustrate_case
Open slide detailBeat · Satisfaction
18
The slide uses a cost-per-transistor vs technology node chart to illustrate the benefit of moving from SoC to chiplets.present_solution
Open slide detailBeat · Satisfaction
19
The slide uses visual comparisons between traditional bump-based thermo-compression and bump-less hybrid bonding.present_solution
Open slide detailBeat · Satisfaction
20
transition
Open slide detailBeat · SatisfactionLoop · Quick Win Big Bet
21
frame_problem
Open slide detailBeat · SatisfactionLoop · Cost Of Inaction
22
The slide uses a grid layout to map specific product lines (SPTS, ICOS, CIRCL, etc.) to their respective application areas.present_solution
Open slide detailBeat · SatisfactionLoop · Cost Of Inaction
23
The slide uses a central diagram of a chip package to anchor the four quadrants of the ecosystem.establish_context
Open slide detailBeat · ActionLoop · Cost Of Inaction
24
The slide uses a three-column layout to categorize technical imagery and data visualizations related to semiconductor manufacturing processes.other
Open slide detailBeat · ActionLoop · Cost Of Inaction
25
BKM stands for Best Known Methods. The slide uses a process flow diagram and a functional decomposition of the analysis workflow.present_solution
Open slide detailBeat · ActionLoop · Cost Of Inaction
26
transition
Open slide detailBeat · ActionLoop · Quick Win Big Bet
27
The chart uses a combination of a bar chart and a table to show growth drivers over time.analyze_data
Open slide detailBeat · ActionLoop · Quick Win Big Bet
28
summarize
Open slide detailBeat · Action