Chip startup Ayar Labs used this pitch deck to raise $35 million — playbook

Chip startup Ayar Labs used this pitch deck to raise $35 million

Ayar Labs

arc beats above · slides in the middle · loops below · scroll → 1 LOOPS

Deck intelligence map

5

coverage by narrative range · generated from this deck JSON

Narrative range 13 total

Metadata

Components

Metrics

Tools

Frameworks

Beats

Loops

Problem 1 slides 100% 1/1 slides 100% 1/1 slides · 9 hits

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100% 1/1 slides · 2 hits 100% 1/1 slides 100% 1/1 slides 100% 1/1 slides Solution 9 slides 100% 9/9 slides 100% 9/9 slides · 59 hits

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22.2% 2/9 slides · 3 hits 11.1% 1/9 slides 100% 9/9 slides · 11 hits 100% 9/9 slides Market Size 1 slides 100% 1/1 slides 100% 1/1 slides · 5 hits

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100% 1/1 slides · 2 hits 100% 1/1 slides Team 1 slides 100% 1/1 slides 100% 1/1 slides · 10 hits

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100% 1/1 slides · 2 hits 100% 1/1 slides Traction 1 slides 100% 1/1 slides 100% 1/1 slides · 7 hits

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100% 1/1 slides · 2 hits

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100% 1/1 slides 100% 1/1 slides

Slide inventory

16

every slide · same image gating as the playbook

01

front_matter

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02

Uses a historical citation (Moore's 1965 paper) to validate the current industry shift toward disaggregation.frame_problem

Open slide detailBeat · ProblemLoop · Cost Of Inaction

03

The slide uses a road metaphor background, likely implying a path forward or future-looking technology.present_solution

Open slide detailBeat · SolutionLoop · Cost Of Inaction

04

The slide uses authority bias by citing experts from Lawrence Livermore National Laboratory and OpenAI to validate the company's technological direction.cite_precedent

Open slide detailBeat · SolutionLoop · Cost Of Inaction

05

size_opportunity

Open slide detailBeat · SolutionLoop · Cost Of Inaction

06

other

Open slide detailBeat · SolutionLoop · Cost Of Inaction

07

The slide uses two charts to demonstrate the power scaling problem and the efficiency drop-off as interconnect distance increases.argue_timing

Open slide detailBeat · SolutionLoop · Cost Of Inaction

08

The slide uses industry examples (Intel, NVIDIA, Xilinx, AMD) to validate the adoption of multi-chip packaging.present_solution

Open slide detailBeat · SolutionLoop · Cost Of Inaction

09

The slide highlights the separation of the laser source from the high-temperature package, enabling efficient optical communication.present_solution

Open slide detailBeat · SolutionLoop · Cost Of Inaction

10

present_solution

Open slide detailBeat · SolutionLoop · Cost Of Inaction

11

Includes a technical diagram of the chiplet assembly, a microscopic view, and a physical product photo.present_solution

Open slide detailBeat · SolutionLoop · Cost Of Inaction

12

The slide features a DARPA press release snippet and photos of the hardware (wafer and chip modules).show_traction

Open slide detailBeat · TractionLoop · Cost Of Inaction

13

The slide uses a timeline to illustrate product development milestones.show_traction

Open slide detailLoop · Cost Of Inaction

14

The slide uses a grid layout to map industry verticals to technical applications.decompose_segments

Open slide detailLoop · Cost Of Inaction

15

The slide uses a bulleted list structure to justify the $10B TAM figure.size_opportunity

Open slide detailLoop · Cost Of Inaction

16

appendix

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