KLA | Investor Presentation Deck | 29 slides · page 9 of 29
KLA | Investor Presentation Deck | 29 slides · slide 9
Conference presentation · market_sizing · size_opportunity · overcrowded density
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Slide schematic 9/9
diagram 2/2 list 3/3 source-note 2/2 table 1/1 title 1/1
Components 9
process timeline bullet bullet bullet source-note source-note data headline
Tools 2
2x2 matrix slide · 70%
table/data: KLA: ICOS Orbotech: PCB $900M $430M² PCB, Substrate, Components KLA: SWIFT, ICOS Orbotech: PCB, SPTS $350M ~ $1,350M (2023E) $100M³ ~ $400M (2023E) Advanced Packaging, Advanced Substrate
List presentation slide · 80%list/bullet: Advanced Packaging: Interconnect 1µm to 5µm, Panel and Wafer Opportunities
Metrics 0
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Frameworks 0
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