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AMD | Investor Day Presentation Deck | 219 slides · page 50 of 120

Technical comparison of packaging technologies.

Conference presentation · propose_solution · present_solution · dense density

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image 2/2 list 1/1 metric 2/2 source-note 1/1 title 1/1
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illustration illustration comparison big-number big-number source-note headline
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Comparison frame slide · 70%

list/comparison: 2.5D Elevated Fanout Bridge features: Scalable Solution, Standard Flip Chip Process, Standard Substrates, Lithographically Defined, Lower Complexity Bumping, Assembly Process, Lower Cost
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