{
  "docId": "019de515-f4a8-75fb-8eb2-e4986460c521",
  "docSlug": "1f9d26532cfa53f888ae9260987ed1d6",
  "documentTitle": "KLA | Investor Presentation Deck | 29 slides",
  "authorId": "kla",
  "authorName": "KLA",
  "documentKindSlug": "conference-presentation",
  "documentKindLabel": "Conference presentation",
  "sourceTypeSlug": "investor_relations",
  "sourceTypeLabel": "Investor relations",
  "presentationDate": "2023-06-01 00:00:00",
  "orientation": "landscape",
  "aspectRatio": 1.7777778,
  "pageNumber": 28,
  "pageCount": 29,
  "prevPage": 27,
  "nextPage": 29,
  "slideType": "executive_summary",
  "function": "summarize",
  "density": "overcrowded",
  "nDataPoints": 0,
  "notes": null,
  "elementsJson": null,
  "metadataConfidence": 0.9,
  "imagePath": null,
  "slideHref": "/slides/019de515-f4a8-75fb-8eb2-e4986460c521/28",
  "deckHref": "/decks/019de515-f4a8-75fb-8eb2-e4986460c521",
  "deckJsonHref": "/decks/019de515-f4a8-75fb-8eb2-e4986460c521.json",
  "deckAnchorHref": "/decks/019de515-f4a8-75fb-8eb2-e4986460c521#slide-28",
  "components": [
    {
      "bbox": {
        "h": 0.05,
        "w": 0.36,
        "x": 0.099,
        "y": 0.38
      },
      "kind": "list",
      "text": "Heterogeneous integration is a key component in enabling overall semiconductor technology roadmap.",
      "attrs": {},
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "0ec5081d-1b85-407b-8365-cbf28b30c1e1",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.05,
        "w": 0.36,
        "x": 0.599,
        "y": 0.73
      },
      "kind": "list",
      "text": "Inline defect screening is being adopted by automotive fabs to reduce escapes for reliability sensitive devices.",
      "attrs": {},
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "59d83d6c-78a2-4412-9ef6-3dbdc8f9f26b",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.06,
        "w": 0.36,
        "x": 0.099,
        "y": 0.56
      },
      "kind": "list",
      "text": "Front end, packaging and substrate domains are becoming integrated just like the packages and systems they create.",
      "attrs": {},
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "674d9854-f3a4-4590-ae47-5d420a00cd43",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.06,
        "w": 0.36,
        "x": 0.099,
        "y": 0.73
      },
      "kind": "list",
      "text": "KLA will provide solutions to bridge front end, packaging and substrate worlds, given the large presence in all these markets.",
      "attrs": {},
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "ad353abe-92e7-4cd3-88bf-d2c15fe30dae",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.05,
        "w": 0.36,
        "x": 0.099,
        "y": 0.19
      },
      "kind": "list",
      "text": "The front end semiconductor industry continues to produce innovation pushing Moore's Law forward.",
      "attrs": {},
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "c200d664-33d7-41c9-b4e8-a425c724a8b3",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.05,
        "w": 0.36,
        "x": 0.599,
        "y": 0.56
      },
      "kind": "list",
      "text": "The rise of SiC power semi devices poses additional yield, reliability, and cost challenges.",
      "attrs": {},
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "ceea5fb1-b953-4011-bb2c-ed175ae13f14",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.06,
        "w": 0.36,
        "x": 0.599,
        "y": 0.19
      },
      "kind": "list",
      "text": "The automotive industry has been forever changed by the chip shortage, vehicle electrification and the software-defined vehicle.",
      "attrs": {},
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "d6f56456-3a58-4bd0-b3cd-5d72b3713f13",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.06,
        "w": 0.36,
        "x": 0.599,
        "y": 0.38
      },
      "kind": "list",
      "text": "KLA works closely with the automotive ecosystem to develop a comprehensive portfolio of process control solutions.",
      "attrs": {},
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "f33e8e0b-0494-49c4-92ab-a981acae44bf",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.02,
        "w": 0.568,
        "x": 0.216,
        "y": 0.879
      },
      "kind": "paragraph",
      "text": "Packaging and Automotive Markets – New Growth Engines for KLA",
      "attrs": {},
      "subkind": "paragraph",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "cbaeb889-ce99-4140-9045-0fc87f55bcc1",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.01,
        "w": 0.21,
        "x": 0.038,
        "y": 0.95
      },
      "kind": "source-note",
      "text": "28 KLA Non-Confidential | Unrestricted",
      "attrs": {},
      "subkind": null,
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "6ab495e9-8f7f-4540-8dd5-da40b238d755",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.03,
        "w": 0.16,
        "x": 0.038,
        "y": 0.06
      },
      "kind": "title",
      "text": "Summary",
      "attrs": {},
      "subkind": "headline",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "0bd6a5a2-5159-4125-a705-16fc783572e0",
      "frameworkName": null,
      "frameworkSlug": null
    }
  ],
  "metrics": [],
  "tools": [],
  "frameworks": [],
  "arcBeats": [],
  "loops": [],
  "imagePathAlt": null,
  "thumbSrc": null,
  "thumbSrcAlt": null,
  "locked": true
}