{
  "docId": "019de515-f4a8-75fb-8eb2-e4986460c521",
  "docSlug": "1f9d26532cfa53f888ae9260987ed1d6",
  "documentTitle": "KLA | Investor Presentation Deck | 29 slides",
  "authorId": "kla",
  "authorName": "KLA",
  "documentKindSlug": "conference-presentation",
  "documentKindLabel": "Conference presentation",
  "sourceTypeSlug": "investor_relations",
  "sourceTypeLabel": "Investor relations",
  "presentationDate": "2023-06-01 00:00:00",
  "orientation": "landscape",
  "aspectRatio": 1.7777778,
  "pageNumber": 19,
  "pageCount": 29,
  "prevPage": 18,
  "nextPage": 20,
  "slideType": "other",
  "function": "illustrate_case",
  "density": "sparse",
  "nDataPoints": 0,
  "notes": null,
  "elementsJson": null,
  "metadataConfidence": 0.9,
  "imagePath": null,
  "slideHref": "/slides/019de515-f4a8-75fb-8eb2-e4986460c521/19",
  "deckHref": "/decks/019de515-f4a8-75fb-8eb2-e4986460c521",
  "deckJsonHref": "/decks/019de515-f4a8-75fb-8eb2-e4986460c521.json",
  "deckAnchorHref": "/decks/019de515-f4a8-75fb-8eb2-e4986460c521#slide-19",
  "components": [
    {
      "bbox": {
        "h": 0.603,
        "w": 0.937,
        "x": 0.03,
        "y": 0.22
      },
      "kind": "diagram",
      "text": "front end semiconductor, packaging, IC substrates",
      "attrs": null,
      "subkind": "process",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "b4ebfdff-c2bd-4bde-834c-6229681c28a3",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.013,
        "w": 0.229,
        "x": 0.037,
        "y": 0.953
      },
      "kind": "source-note",
      "text": "19 KLA Non-Confidential | Unrestricted",
      "attrs": null,
      "subkind": null,
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "d5d549a2-57cb-41d8-a6b9-56b4eca18024",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.04,
        "w": 0.869,
        "x": 0.037,
        "y": 0.065
      },
      "kind": "title",
      "text": "IC Substrate Processes are Blending with Wafer-Level Packaging",
      "attrs": null,
      "subkind": "headline",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "41af6fd8-3d1e-436e-9399-2a01b2a6b26d",
      "frameworkName": null,
      "frameworkSlug": null
    }
  ],
  "metrics": [],
  "tools": [],
  "frameworks": [],
  "arcBeats": [
    {
      "to": 21,
      "from": 13,
      "beatId": "a0b407a2-8af5-43c5-8a7f-721b30762867",
      "arcName": "The Sequoia Pitch",
      "arcSlug": "sequoia-pitch",
      "beatName": "Solution",
      "beatSlug": "sequoia-pitch-solution",
      "evidence": "Slides 13-21 present KLA's solutions for advanced packaging, automotive electronics, and heterogeneous integration.",
      "position": 2,
      "confidence": 0.8,
      "parentBeatName": "Turn",
      "parentBeatSlug": "turn"
    }
  ],
  "loops": [
    {
      "to": 21,
      "from": 11,
      "name": "Cost Of Inaction",
      "slug": "27-cost-of-inaction",
      "bestFor": "Urgent budget requests, compliance, risk mitigation",
      "matchId": "6ed0ccba-1353-4e14-9daf-175781400757",
      "evidence": "The deck presents the challenges in semiconductor scaling and the benefits of KLA's solutions.",
      "position": 0,
      "objective": "Highlight the importance of KLA's solutions in enabling fast-growing applications",
      "structure": "The Status Quo -> The Hidden Costs Accumulating -> The Future State of Inaction -> The Tipping Point",
      "confidence": 0.6,
      "description": "Quantify what happens if the audience does nothing"
    }
  ],
  "imagePathAlt": null,
  "thumbSrc": null,
  "thumbSrcAlt": null,
  "locked": true
}