{
  "docId": "019de511-0c60-7704-b0ea-9f2d427a4bbc",
  "docSlug": "fe597c92c18d628fb1f5482ec1735e3f",
  "documentTitle": "KLA | Investor Conference Presentation Deck | 28 slides",
  "authorId": "kla",
  "authorName": "KLA",
  "documentKindSlug": "conference-presentation",
  "documentKindLabel": "Conference presentation",
  "sourceTypeSlug": "investor_relations",
  "sourceTypeLabel": "Investor relations",
  "presentationDate": "2021-06-01 00:00:00",
  "orientation": "landscape",
  "aspectRatio": 1.2938006,
  "pageNumber": 23,
  "pageCount": 28,
  "prevPage": 22,
  "nextPage": 24,
  "slideType": "other",
  "function": "establish_context",
  "density": "dense",
  "nDataPoints": 0,
  "notes": "The slide uses a central diagram of a chip package to anchor the four quadrants of the ecosystem.",
  "elementsJson": null,
  "metadataConfidence": 0.9,
  "imagePath": null,
  "slideHref": "/slides/019de511-0c60-7704-b0ea-9f2d427a4bbc/23",
  "deckHref": "/decks/019de511-0c60-7704-b0ea-9f2d427a4bbc",
  "deckJsonHref": "/decks/019de511-0c60-7704-b0ea-9f2d427a4bbc.json",
  "deckAnchorHref": "/decks/019de511-0c60-7704-b0ea-9f2d427a4bbc#slide-23",
  "components": [
    {
      "bbox": {
        "h": 0.2,
        "w": 0.3,
        "x": 0.35,
        "y": 0.445
      },
      "kind": "image",
      "text": "Central chip package diagram",
      "attrs": null,
      "subkind": "illustration",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "76eb3ad8-b0e3-4dd3-8b6c-8e1cf4827c02",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.22,
        "w": 0.9,
        "x": 0.05,
        "y": 0.44
      },
      "kind": "image",
      "text": "Company logos for each quadrant",
      "attrs": null,
      "subkind": "logo-grid",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "f7dcce33-d3b1-4c63-9392-792b3f488e98",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.1,
        "w": 0.38,
        "x": 0.105,
        "y": 0.305
      },
      "kind": "list",
      "text": "3D SoC with cache memory on µP cores for HPC; Hybrid bonding for high interconnect density and low power",
      "attrs": null,
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "1ba1efb1-1af7-4674-bd3a-ef8eff2e5ff0",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.1,
        "w": 0.38,
        "x": 0.515,
        "y": 0.705
      },
      "kind": "list",
      "text": "IC substrate scaling to 5/5µm and below; ABF roadmap for L/S scaling",
      "attrs": null,
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "298ff194-d81b-4aed-a3ef-27a45162212d",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.1,
        "w": 0.38,
        "x": 0.515,
        "y": 0.305
      },
      "kind": "list",
      "text": "3D-IC DRAM die stacked on logic; HBM demand increasing for AI and data centers; Hybrid bonding expected HVM in 2022-23",
      "attrs": null,
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "466b686b-91b6-4998-89bf-5cef40897877",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.1,
        "w": 0.38,
        "x": 0.105,
        "y": 0.705
      },
      "kind": "list",
      "text": "2.5D interposer-based die partitioning with TSV; Competition by TSV-less interposer like RDL or HD-FO; Heterogeneous integration",
      "attrs": null,
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "ea807a06-64c2-4c90-86a6-f4747ff7deed",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.045,
        "w": 0.435,
        "x": 0.037,
        "y": 0.185
      },
      "kind": "title",
      "text": "Advanced Packaging Ecosystem",
      "attrs": null,
      "subkind": "headline",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "ff648678-8a0a-4410-8597-a257832e1e49",
      "frameworkName": null,
      "frameworkSlug": null
    }
  ],
  "metrics": [],
  "tools": [
    {
      "name": "List presentation",
      "slug": "list-presentation",
      "agent": null,
      "layer": "slide",
      "matchId": "b205e338-cd04-43c8-9f07-af50d10ab088",
      "evidence": "list/bullet: 2.5D interposer-based die partitioning with TSV; Competition by TSV-less interposer like RDL or HD-FO; Heterogeneous integration",
      "confidence": 0.8
    }
  ],
  "frameworks": [],
  "arcBeats": [
    {
      "to": 28,
      "from": 23,
      "beatId": "0db284db-3d9f-4c08-a7e7-a11d2a81cebb",
      "arcName": "Monroe's Motivated Sequence",
      "arcSlug": "monroes-sequence",
      "beatName": "Action",
      "beatSlug": "monroes-sequence-action",
      "evidence": "The deck concludes with a call to action and a summary of KLA's growth opportunities",
      "position": 3,
      "confidence": 0.8,
      "parentBeatName": "Resolution",
      "parentBeatSlug": "resolution"
    }
  ],
  "loops": [
    {
      "to": 25,
      "from": 21,
      "name": "Cost Of Inaction",
      "slug": "27-cost-of-inaction",
      "bestFor": "Urgent budget requests, compliance, risk mitigation",
      "matchId": "59dccd5c-7610-472a-b2ca-d03486cd90b7",
      "evidence": "The deck presents the challenges of advanced packaging and KLA's solutions",
      "position": 0,
      "objective": "Highlight the consequences of not addressing advanced packaging challenges",
      "structure": "The Status Quo -> The Hidden Costs Accumulating -> The Future State of Inaction -> The Tipping Point",
      "confidence": 0.7,
      "description": "Quantify what happens if the audience does nothing"
    },
    {
      "to": 27,
      "from": 20,
      "name": "Quick Win Big Bet",
      "slug": "47-quick-win-big-bet",
      "bestFor": "Transformation planning, 100-day plans, resource allocation",
      "matchId": "a131176c-710e-4b4a-9095-4582a658a4b8",
      "evidence": "The deck highlights KLA's potential for growth in advanced packaging",
      "position": 1,
      "objective": "Present KLA's growth opportunities in advanced packaging",
      "structure": "The Full List -> Quick Wins (Low effort, High impact) -> Big Bets (High effort, High impact) -> Sequenced Roadmap",
      "confidence": 0.6,
      "description": "Separate initiatives into immediate wins and longer-term strategic bets"
    }
  ],
  "imagePathAlt": null,
  "thumbSrc": null,
  "thumbSrcAlt": null,
  "locked": true
}