{
  "docId": "019de511-0c60-7704-b0ea-9f2d427a4bbc",
  "docSlug": "fe597c92c18d628fb1f5482ec1735e3f",
  "documentTitle": "KLA | Investor Conference Presentation Deck | 28 slides",
  "authorId": "kla",
  "authorName": "KLA",
  "documentKindSlug": "conference-presentation",
  "documentKindLabel": "Conference presentation",
  "sourceTypeSlug": "investor_relations",
  "sourceTypeLabel": "Investor relations",
  "presentationDate": "2021-06-01 00:00:00",
  "orientation": "landscape",
  "aspectRatio": 1.2938006,
  "pageNumber": 19,
  "pageCount": 28,
  "prevPage": 18,
  "nextPage": 20,
  "slideType": "propose_solution",
  "function": "present_solution",
  "density": "dense",
  "nDataPoints": 0,
  "notes": "The slide uses visual comparisons between traditional bump-based thermo-compression and bump-less hybrid bonding.",
  "elementsJson": null,
  "metadataConfidence": 0.95,
  "imagePath": null,
  "slideHref": "/slides/019de511-0c60-7704-b0ea-9f2d427a4bbc/19",
  "deckHref": "/decks/019de511-0c60-7704-b0ea-9f2d427a4bbc",
  "deckJsonHref": "/decks/019de511-0c60-7704-b0ea-9f2d427a4bbc.json",
  "deckAnchorHref": "/decks/019de511-0c60-7704-b0ea-9f2d427a4bbc#slide-19",
  "components": [
    {
      "bbox": {
        "h": 0.07,
        "w": 0.94,
        "x": 0.03,
        "y": 0.74
      },
      "kind": "callout",
      "text": "Several Inspection, Metrology and Integration Challenges",
      "attrs": null,
      "subkind": "primary",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "ca88297d-960b-4299-9577-d84de78e62c9",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.25,
        "w": 0.45,
        "x": 0.47,
        "y": 0.3
      },
      "kind": "image",
      "text": "Thermo-Compression vs Hybrid Bonding comparison",
      "attrs": null,
      "subkind": "illustration",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "a9bc4de2-b4a5-4889-a4cc-f79f4bc26a2d",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.35,
        "w": 0.35,
        "x": 0.08,
        "y": 0.25
      },
      "kind": "image",
      "text": "Integration Schemes (a, b, c, d)",
      "attrs": null,
      "subkind": "illustration",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "d835706d-77e3-4445-9275-17d0a1b14748",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.1,
        "w": 0.85,
        "x": 0.08,
        "y": 0.63
      },
      "kind": "list",
      "text": "Key Benefits: Speed, Bandwidth and Power Efficiency through increased interconnect density\nHybrid Bonding in Packaging with D2W integration key for AI Logic Chips and High Bandwidth Memory",
      "attrs": null,
      "subkind": "bullet",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "6248a275-a605-4c32-a6d1-2de228a4aa03",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.05,
        "w": 0.9,
        "x": 0.05,
        "y": 0.15
      },
      "kind": "title",
      "text": "Hybrid Bonding: The Big Next Inflection in Heterogeneous Integration",
      "attrs": null,
      "subkind": "headline",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "48be17d4-2eea-4187-9a39-030458718667",
      "frameworkName": null,
      "frameworkSlug": null
    }
  ],
  "metrics": [],
  "tools": [
    {
      "name": "List presentation",
      "slug": "list-presentation",
      "agent": null,
      "layer": "slide",
      "matchId": "9b022c5c-4548-4ce2-a785-8e3f671183c0",
      "evidence": "list/bullet: Key Benefits: Speed, Bandwidth and Power Efficiency through increased interconnect density",
      "confidence": 0.8
    }
  ],
  "frameworks": [],
  "arcBeats": [
    {
      "to": 22,
      "from": 15,
      "beatId": "89034f17-1495-4740-aef3-8c35b2da19e6",
      "arcName": "Monroe's Motivated Sequence",
      "arcSlug": "monroes-sequence",
      "beatName": "Satisfaction",
      "beatSlug": "monroes-sequence-satisfaction",
      "evidence": "The deck presents KLA's solutions and capabilities in advanced packaging",
      "position": 2,
      "confidence": 0.8,
      "parentBeatName": "Turn",
      "parentBeatSlug": "turn"
    }
  ],
  "loops": [],
  "imagePathAlt": null,
  "thumbSrc": null,
  "thumbSrcAlt": null,
  "locked": true
}