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  "documentTitle": "Lasertec Corporation (6920)",
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  "presentationDate": "2024-06-05 00:00:00",
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  "notes": "The slide details a technical shift in semiconductor mask inspection, highlighting a move away from Lasertec's EUV tools toward a combination of DUV (KLA) and E-beam (Holon) technologies.",
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      "text": "要はマスクを検査するために、光学の深紫外線と電子ビームを組み合わせる必要があるのです。",
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      "text": "上記の半導体企業の幹部によると、TSMCはレーザーテックが2019年〜2020年に極端紫外線マスク検査装置を発売する以前に使っていた深紫外線検査技術に戻った、という。 (1) 193ナノメートルの光源が搭載されているKLA製のTeron装置を使う。 (2) 極端紫外線マスクに発見した欠陥の座標を記録する。 (3) 座標を電子ビーム検査装置（走査電子顕微鏡）に移す。",
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      "text": "半導体企業の幹部は、TSMCが使っている電子ビーム検査装置の製造元は「ホロン」という日本の会社だ、という。彼はホロンのCEOと友人関係で、ホロンはTSMCのほかに、インテルやサムスンなど、極端紫外線の領域で事業展開している多くの会社で採用されている、という...",
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      "text": "第10部 レーザーテックの極端紫外線装置は極度に不良で信頼性が低い。そのため、主要な顧客であるTSMC、インテル、サムスンは水面下で、KLA製のTeron深紫外線装置と電子ビームを組み合わせた“非極端紫外線”の検査法を代用している...",
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