{ "docId": "019dd923-622c-750b-8b9a-0f4bec37392f", "docSlug": "f982379e2e48", "documentTitle": "Lasertec Corporation (6920)", "authorId": "58_Scorpion_Capital", "authorName": "Scorpion Capital", "documentKindSlug": "activist-deck", "documentKindLabel": "Activist deck", "sourceTypeSlug": "short_seller", "sourceTypeLabel": "Short seller", "presentationDate": "2024-06-05 00:00:00", "orientation": "landscape", "aspectRatio": 1.3333334, "pageNumber": 288, "pageCount": 334, "prevPage": 287, "nextPage": 289, "slideType": "quote_slide", "function": "expose_contradiction", "density": "dense", "nDataPoints": 0, "notes": "The slide uses a Q&A format to highlight a technical limitation in TSMC's current process.", "elementsJson": [ "paragraph", "quote_block", "footnote" ], "metadataConfidence": 1, "imagePath": null, "slideHref": "/slides/019dd923-622c-750b-8b9a-0f4bec37392f/288", "deckHref": "/decks/019dd923-622c-750b-8b9a-0f4bec37392f", "deckJsonHref": "/decks/019dd923-622c-750b-8b9a-0f4bec37392f.json", "deckAnchorHref": "/decks/019dd923-622c-750b-8b9a-0f4bec37392f#slide-288", "components": [ { "bbox": null, "kind": "callout", "text": "What they did was use an optical tool from KLA – the Teron product line. And this is an optical tool with a 193-nanometer light source. So, there's a limitation to what defects it can detect.", "attrs": null, "subkind": null, "toolName": "Visual emphasis", "toolSlug": "visual-emphasis", "confidence": null, "componentId": "019dd953-78b7-702e-961d-ad369e4497be", "frameworkName": null, "frameworkSlug": null }, { "bbox": { "h": 0.35, "w": 0.86, "x": 0.07, "y": 0.07 }, "kind": "paragraph", "text": "The Japanese semiconductor executive stated that TSMC has simply reverted to the EUV mask inspection process it used before Lasertec launched its actinic EUV machine in 2019/2020: 1) using KLA’s Teron DUV tool with a 193nm light source; 2) recording the coordinates of potential defects it identified on an EUV mask; 3) transferring the coordinates to an electron beam inspection tool, also known as SEM for scanning electron microscope. DUV can’t distinguish very small defects on EUV masks, so e-beam is used to then analyze “these suspicious-looking defect locations...so they need a combination of optical DUV and electron beam to inspect the mask.”", "attrs": null, "subkind": "paragraph", "toolName": null, "toolSlug": null, "confidence": null, "componentId": "a54250ff-d2c2-4d6d-beb2-d1a29b3e4052", "frameworkName": null, "frameworkSlug": null }, { "bbox": { "h": 0.4, "w": 0.86, "x": 0.07, "y": 0.45 }, "kind": "quote", "text": "Q: “You're saying the fact that they're using optical means that they're not getting the results from the Lasertec machine by itself. They have to use a second tool?” A: “Correct. But the second tool—before Lasertec came out with their actinic tool, they needed to establish some way of inspecting the EUV masks. What they did was use an optical tool from KLA – the Teron product line. And this is an optical tool with a 193-nanometer light source. So, there's a limitation to what defects it can detect. Very small defects, it cannot clearly distinguish. For something that looks like a defect, they record the coordinates, and then these coordinates are transferred to an electron beam inspection tool, which is only looking at these suspicious-looking defect locations. Is the defect on print or not? So, they need a combination of optical DUV and electron beam inspection to inspect the mask.” - Longtime, senior semicap equipment executive in Japan who is friendly with Lasertec's CEO", "attrs": null, "subkind": "testimonial", "toolName": null, "toolSlug": null, "confidence": null, "componentId": "128e347b-f714-488e-b7f7-5485ea260d9e", "frameworkName": null, "frameworkSlug": null }, { "bbox": null, "kind": "quote", "text": "Correct. But the second tool—before Lasertec came out with their actinic tool, they needed to establish some way of inspecting the EUV masks. What they did was use an optical tool from KLA – the Teron product line. And this is an optical tool with a 193-nanometer light source. So, there's a limitation to what defects it can detect. Very small defects, it cannot clearly distinguish. For something that looks like a defect, they record the coordinates, and then these coordinates are transferred to an electron beam inspection tool, which is only looking at these suspicious-looking defect locations. Is the defect on print or not? So, they need a combination of optical DUV and electron beam inspection to inspect the mask. — Longtime, senior semicap equipment executive in Japan who is friendly with Lasertec's CEO", "attrs": null, "subkind": null, "toolName": "Authority citation", "toolSlug": "authority-citation", "confidence": null, "componentId": "019dd953-78b7-702e-961d-b20d72d9a019", "frameworkName": null, "frameworkSlug": null }, { "bbox": { "h": 0.02, "w": 0.3, "x": 0.07, "y": 0.95 }, "kind": "source-note", "text": "Source: Scorpion Capital consultation calls with experts", "attrs": null, "subkind": null, "toolName": null, "toolSlug": null, "confidence": null, "componentId": "96a06991-7b70-4b1f-8159-d967fb335641", "frameworkName": null, "frameworkSlug": null }, { "bbox": { "h": 0.02, "w": 0.5, "x": 0.07, "y": 0.425 }, "kind": "title", "text": "TSMC relying on legacy DUV and scanning electron microscope tools", "attrs": null, "subkind": "headline", "toolName": null, "toolSlug": null, "confidence": null, "componentId": "2701ec0f-cc7d-4937-9ebb-bd712c3b52f6", "frameworkName": null, "frameworkSlug": null } ], "metrics": [], "tools": [], "frameworks": [], "arcBeats": [], "loops": [], "imagePathAlt": null, "thumbSrc": null, "thumbSrcAlt": null, "locked": true }