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      "text": "The Intel SPIE papers confirm challenges with Lasertec’s EUV tool, namely contamination and optics degradation from tin plasma (“ion induced damage to the optical components”); light source stability and brightness level; struggles in managing source brightness vs. source chamber pressure, as high pressure is needed to help mitigate tin debris but which reduces brightness; and unstable plasma which leads to dark pulses and inspection failures",
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      "text": "of the electrode design as well as other changes. Ion induced damage to the optical components such as downstream mirrors was mitigated by development of an effective debris mitigation approach. These improvements have Fast moving ions originating from the plasma hit the collector surface and induce damage by sputtering. This ion induced damage limits the collector lifetime. It is necessary to reduce the velocity of the ions to minimize ion induced damage. Argon gas at high flow rate is injected in the path of the ions. The argon atoms collide with the fast-moving ions If the discharge condition is not optimized, the plasma becomes unstable and brightness stability becomes worse. Brightness may drop below the threshold required for mask inspection. We term such EUV pulses that has intensity or brightness below the minimum threshold as dark pulses. Reducing and minimizing the number of dark pulses is crucial for quality and throughput of the inspection. Figure 8 shows the trend of the dark pulse count over time. Significant",
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      "text": "Source: https://www.spiedigitallibrary.org/conference-proceedings-of-spie/PC12494/PC124940E/Improvement-of-LDP-EUV-source-performance-for-actinic-patterned-mask/10.1117/12.2671128.full",
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