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  "documentTitle": "Tessera Technologies Inc. (TSRA)",
  "authorId": "03_Starboard_Value",
  "authorName": "Starboard Value",
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  "sourceTypeLabel": "Activist investor",
  "presentationDate": "2013-04-30 00:00:00",
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  "pageCount": 80,
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  "notes": "The chart is an exploded pie chart showing the percentage distribution of patent coverage across various packaging technologies.",
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      "kind": "callout",
      "text": "Broad packaging coverage drives applicability to many markets and above average royalty rates.",
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      "kind": "chart",
      "text": "Portfolio Breakdown pie chart showing percentages for Dicing (4%), Housing (5%), Die Attach (5%), Other (9%), Solder Bump (9%), Stacked and MCP (12%), Electrical Devices (13%), Package Leads (13%), Flip Chip (13%), Mounting/Encapsulating (17%)",
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      "kind": "list",
      "text": "Over 550 issued U.S. patents and pending applications. The patents are applicable to several forms of chip packaging: Ball grid array solution, Solder bump / Flip chip, Chip stacking – Package-on-package.",
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      "kind": "source-note",
      "text": "Source: IPNav Analyzer and United States Patent and Trademark Office. Breakdown based on USPTO classification codes.",
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      "kind": "title",
      "text": "Tessera Inc. – Portfolio Breakdown",
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      "objective": "How can Tessera's portfolio be broken down and optimized?",
      "structure": "The Whole -> Category A (distinct) -> Category B (distinct) -> Category C (distinct) -> Complete Coverage",
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