{
  "docId": "019dd923-5e88-73ef-bd5c-f812573a947a",
  "docSlug": "eea7524c557036f4",
  "documentTitle": "2020 Air Street Capital The State of AI Report 2020",
  "authorId": "AirStreetCapital",
  "authorName": "Air Street Capital",
  "documentKindSlug": "consulting-deck",
  "documentKindLabel": "Consulting deck",
  "sourceTypeSlug": "vc_research",
  "sourceTypeLabel": "VC research",
  "presentationDate": null,
  "orientation": "landscape",
  "aspectRatio": 1.777,
  "pageNumber": 156,
  "pageCount": 177,
  "prevPage": 155,
  "nextPage": 157,
  "slideType": "competitive_analysis",
  "function": "compare_peers",
  "density": "dense",
  "nDataPoints": 15,
  "notes": "Includes a line chart of financial metrics and a timeline of semiconductor process nodes.",
  "elementsJson": [
    "headline_text",
    "action_title",
    "paragraph",
    "line_chart",
    "timeline_visual",
    "comparison_table"
  ],
  "metadataConfidence": 0.95,
  "imagePath": null,
  "slideHref": "/slides/019dd923-5e88-73ef-bd5c-f812573a947a/156",
  "deckHref": "/decks/019dd923-5e88-73ef-bd5c-f812573a947a",
  "deckJsonHref": "/decks/019dd923-5e88-73ef-bd5c-f812573a947a.json",
  "deckAnchorHref": "/decks/019dd923-5e88-73ef-bd5c-f812573a947a#slide-156",
  "components": [
    {
      "bbox": null,
      "kind": "callout",
      "text": "TSMC's R&D expenses match SMIC's revenues.",
      "attrs": null,
      "subkind": null,
      "toolName": "Visual emphasis",
      "toolSlug": "visual-emphasis",
      "confidence": null,
      "componentId": "019dd952-47c5-73ac-aa70-21c6608da817",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.5,
        "w": 0.45,
        "x": 0.05,
        "y": 0.38
      },
      "kind": "chart",
      "text": "Line chart showing SMIC revenues, TSMC R&D expenses, and other financial metrics from 2012-2020.",
      "attrs": null,
      "subkind": "line",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "0c4fb3e4-5336-408e-b131-2ee8da07b3a0",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.25,
        "w": 0.45,
        "x": 0.52,
        "y": 0.38
      },
      "kind": "chart",
      "text": "Timeline of semiconductor manufacturing nodes by company and year.",
      "attrs": null,
      "subkind": "timeline",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "4e254d0c-a474-4a72-81f9-e83593d86777",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": null,
      "kind": "metric",
      "text": "R&D expenditure: $6.7B",
      "attrs": null,
      "subkind": "primary",
      "toolName": "Quantification",
      "toolSlug": "quantification",
      "confidence": null,
      "componentId": "019dd952-47c5-73ac-aa70-244ff63e3d59",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.12,
        "w": 0.9,
        "x": 0.05,
        "y": 0.22
      },
      "kind": "paragraph",
      "text": "TSMC’s R&D expenses match SMIC’s revenues. TSMC is the only fabricator with 5nm manufacturing process (N5) and it is now working on 3nm (N3) for 2x more power efficiency and 33% more performance than N7. In response, SMIC said it will increase capital expenditure to $6.7B in 2020 (up from its original target of $3.1B).",
      "attrs": null,
      "subkind": "paragraph",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "14c96e93-d0b8-448c-8708-91cd47d8fb7b",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.25,
        "w": 0.45,
        "x": 0.52,
        "y": 0.65
      },
      "kind": "table",
      "text": "Performance comparison table for different process nodes.",
      "attrs": null,
      "subkind": "data",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "1bad96b8-a51d-42e4-8804-f01d0dcd0986",
      "frameworkName": null,
      "frameworkSlug": null
    },
    {
      "bbox": {
        "h": 0.05,
        "w": 0.9,
        "x": 0.05,
        "y": 0.14
      },
      "kind": "title",
      "text": "Taiwan’s TSMC remains dominant in R&D expenditure and semiconductor manufacturing",
      "attrs": null,
      "subkind": "headline",
      "toolName": null,
      "toolSlug": null,
      "confidence": null,
      "componentId": "0eec30d2-410c-4d81-b323-a994526eed34",
      "frameworkName": null,
      "frameworkSlug": null
    }
  ],
  "metrics": [],
  "tools": [
    {
      "name": "2x2 matrix",
      "slug": "matrix-2x2",
      "agent": null,
      "layer": "slide",
      "matchId": "c4f1453e-adcb-403a-997d-34baae6b469e",
      "evidence": "Performance comparison table for different process nodes.",
      "confidence": 0.7
    },
    {
      "name": "Concrete Language",
      "slug": "concrete-language",
      "agent": "Storyteller",
      "layer": "slide",
      "matchId": "019dd95a-0fd5-7148-8ed0-59cc2faad8c3",
      "evidence": "TSMC R&D = SMIC revenue comparison.",
      "confidence": 75
    }
  ],
  "frameworks": [],
  "arcBeats": [
    {
      "to": 170,
      "from": 130,
      "beatId": "019dd95a-0682-776c-8e34-f2fc34acb214",
      "arcName": "The Triple Take",
      "arcSlug": "triple-take",
      "beatName": "The Implications (So What)",
      "beatSlug": "triple-take-the-implications-so-what",
      "evidence": "Politics section unpacks ethical, geopolitical and labor consequences.",
      "position": 2,
      "confidence": 60,
      "parentBeatName": "Reflection",
      "parentBeatSlug": "reflection"
    },
    {
      "to": 170,
      "from": 130,
      "beatId": "019dd95a-0682-776c-8e35-01ef1d0aee03",
      "arcName": "The Mountain",
      "arcSlug": "mountain",
      "beatName": "Climax",
      "beatSlug": "mountain-climax",
      "evidence": "Politics section dramatises facial recognition, military, US/China conflicts.",
      "position": 3,
      "confidence": 40,
      "parentBeatName": "Turn",
      "parentBeatSlug": "turn"
    }
  ],
  "loops": [
    {
      "to": 160,
      "from": 153,
      "name": "Pattern Hunter",
      "slug": "02-pattern-hunter",
      "bestFor": "Time-pressed audiences, building consensus, when data is strong",
      "matchId": "019dd95a-07fe-70ce-8d3d-34d60d543d62",
      "evidence": "Sanctions, Huawei, TSMC dominance, Chinese fund, talent poaching, CHIPS Act, blocked M&A.",
      "position": 20,
      "objective": "Map US-China semiconductor decoupling and TSMC centrality",
      "structure": "Evidence A -> Evidence B -> Evidence C -> Pattern/Conclusion",
      "confidence": 75,
      "description": "Group multiple pieces of evidence that together point to a pattern or conclusion"
    }
  ],
  "imagePathAlt": null,
  "thumbSrc": null,
  "thumbSrcAlt": null,
  "locked": true
}